In many engineering projects, structures are designed for lifetimes of decades or even hundreds of years. Creep can be one of the causes of significant time-dependent and irreversible deformation in certain structures. It is therefore necessary to take account of creep at the design stage, not only to provide safety of personnel during construction, but also to ensure the feasibility, safety and sustainability of operations over the long term.
Creep affects a wide range of materials. Even on the scale of a single material, it is linked to deformations of the microstructure, influenced by stress, chemical, thermal and environmental effects. Its study requires the implementation of multi-disciplinary, multi-scale and multi-physics approaches.
On the basis of current progress, the primary objective of this workshop is to highlight how each community approaches the issue of material creep. This seminar will review different theoretical approaches, experimental characterisation methods at one or more scales, as well as the different constitutive models developed, considering the multi-physical and multi-scale effects on the long-term behaviour of materials.
The workshop will take place over two days, with 4 sessions in total. Each session will consist of different oral presentations (25 minutes + 10 minutes for questions) focusing on one theme.
Preliminary program now online!
Registration now open!
To participate in the CREAMS workshop, please take a moment to register via the left menu.
Registration is FREE for all attendees.
Note that access to the lunch and coffee breaks will be offered for free, only for the first 50 registered participants, so don't wait to secure your spot!
Engage in our Poster Session:
We offer the possibility to exchange during our Poster Session, scheduled after the lunch break on the first day of the conference.
To participate, please submit an abstract of not more than 400 words until October 24th.
For any inquiries or assistance, please feel free to contact us through creams@sciencesconf.org.
Loading... 
